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STA339BWS13TR - STMicroelectronics

Description: STMicroelectronics STA339BWS13TR, Audio System Circuit 192kHz I2S 100dB 2 x 20 W, 2 x 9 + 1 x 20 W 4.5 → 21.5 V

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STA339BWS13TR - STMicroelectronics - PCB symbol
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STA339BWS13TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-36 EPD
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STA339BWS13TR - STMicroelectronics - 3D model - Small Outline Packages - PowerSSO-36 EPD
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STA339BWS13TR Details

  • Manufacturer Part Number:

    STA339BWS13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    STMicroelectronics

  • Additional Feature:

    ALSO REQUIRES 3.3V DIGITAL SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.47 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max (Vsup):

    21.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin (Sn) - immersion

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

STA339BWS13TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the STA339BWS13TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal management, and consider using thermal interface materials to improve heat dissipation.
  • The recommended decoupling capacitors for the STA339BWS13TR are 100nF to 1uF ceramic capacitors, placed as close as possible to the device's power pins. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the STA339BWS13TR, start by checking the power supply voltage, ensuring it's within the recommended range. Then, verify the clock signal and data transmission. If issues persist, check the PCB layout and thermal management. Consult the datasheet and application notes for more guidance.
  • Operating the STA339BWS13TR at low supply voltages can affect its performance and reliability. Ensure the supply voltage is within the recommended range (typically 4.5V to 5.5V) to maintain optimal performance and prevent potential issues.

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STA339BWS13TR Overview

Use the download button to access the STA339BWS13TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STA33, or try a keyword search, such as Other Consumer ICs

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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