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STB14N80K5 - STMicroelectronics

Description: N-channel 800 V, 0.400 Ohm typ., 12 A MDmesh K5 Power MOSFET in a D2PAK package

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STB14N80K5 - STMicroelectronics PCB footprint - Other - Other - STB14N80K5-1
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STB14N80K5 - STMicroelectronics  - 3D model - Other - STB14N80K5-1
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STB14N80K5 Details

  • Manufacturer Part Number:

    STB14N80K5

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    245

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STB14N80K5 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the STB14N80K5 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. A safe operating area can be defined as the region where the device can operate without exceeding its maximum ratings. For the STB14N80K5, this region is typically bounded by the maximum drain-source voltage (Vds), maximum drain current (Id), and maximum junction temperature (Tj). Engineers can use the device's characteristics, such as its thermal impedance and maximum power dissipation, to estimate the SOA.
  • To ensure the STB14N80K5 is properly biased for optimal performance, engineers should follow the recommended biasing conditions outlined in the datasheet. This typically includes setting the gate-source voltage (Vgs) within the recommended range, ensuring the drain-source voltage (Vds) is within the maximum rating, and providing a suitable gate drive circuit to minimize switching losses. Additionally, engineers should consider the device's threshold voltage (Vth) and ensure that the gate drive voltage is sufficient to fully turn on the device.
  • Thermal management is critical for the STB14N80K5, as excessive junction temperatures can lead to reduced performance, reliability issues, and even device failure. Engineers should consider the device's thermal impedance, maximum power dissipation, and junction-to-case thermal resistance when designing the thermal management system. This may involve using heat sinks, thermal interfaces, and forced air cooling to keep the junction temperature within the recommended range.
  • To minimize electromagnetic interference (EMI) when using the STB14N80K5, engineers should follow best practices for PCB design, component selection, and layout. This includes using a solid ground plane, minimizing loop areas, and keeping sensitive components away from the power stage. Additionally, engineers should consider using EMI filters, shielding, and snubbers to reduce radiated and conducted emissions.
  • The reliability and lifetime expectations for the STB14N80K5 are dependent on various factors, including the operating conditions, environmental factors, and manufacturing quality. Engineers can refer to the datasheet and relevant industry standards (e.g., IEC 61709) for guidance on reliability and lifetime expectations. Additionally, they should consider performing accelerated life testing and reliability analysis to estimate the device's expected lifetime under specific operating conditions.

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STB14N80K5 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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