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STCD1020RDG6F - STMicroelectronics

Description: Multichannel clock distribution circuit –40 °C to 85 °C

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STCD1020RDG6F - STMicroelectronics - PCB symbol
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PCB Footprints
STCD1020RDG6F - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN - 8-lead, 2 x 2
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STCD1020RDG6F - STMicroelectronics - 3D model - Small Outline No-lead - TDFN - 8-lead, 2 x 2
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STCD1020RDG6F Details

  • Manufacturer Part Number:

    STCD1020RDG6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Nom (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

STCD1020RDG6F Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close as possible to the VIN pin and the GND pin.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Also, ensure that the device is placed away from other noise-sensitive components.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close as possible to the VOUT pin and the GND pin.

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STCD1020RDG6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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