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STCF03TBR - STMicroelectronics

Description: High power white LED driver with I²C interface

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STCF03TBR - STMicroelectronics - PCB symbol
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PCB Footprints
STCF03TBR - STMicroelectronics PCB footprint - BGA - BGA - TFBGA25_2026-1.1
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3D Models
STCF03TBR - STMicroelectronics - 3D model - BGA - TFBGA25_2026-1.1
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STCF03TBR Details

  • Manufacturer Part Number:

    STCF03TBR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, TFBGA-25

  • Pin Count:

    25

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    WITH AUXILIARY LED OUTPUT

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-XBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA25,5X5,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.16 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    1.8 MHz

STCF03TBR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device.
  • Using a lower-rated input capacitor may lead to reduced performance, increased noise, and potential reliability issues. It is recommended to use an input capacitor with a voltage rating that meets or exceeds the maximum input voltage specified in the datasheet to ensure optimal performance and reliability.
  • No, the STCF03TBR is designed for isolated power supply applications and should not be used in non-isolated designs. The device is not intended for use in applications where the input and output voltages are not isolated, and doing so may compromise safety and reliability.
  • STMicroelectronics recommends using a common-mode choke and X-capacitors in the input stage to reduce electromagnetic interference (EMI). The specific filter design will depend on the application and regulatory requirements, but a good starting point is to use a common-mode choke with a minimum impedance of 100 ohms and X-capacitors with a minimum capacitance of 10nF.

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STCF03TBR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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