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STCMB1TR - STMicroelectronics

Description: Power Factor Correction - PFC TM PFC with X-cap discharge and LLC resonant combo controller

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STCMB1TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-20-w
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STCMB1TR - STMicroelectronics  - 3D model - Small Outline Packages - SO-20-w
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STCMB1TR Details

  • Manufacturer Part Number:

    STCMB1TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-20

  • Manufacturer Package Code:

    SO-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    35 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    IEC 61010-1

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max (Isup):

    6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    500 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

STCMB1TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package is recommended for optimal thermal performance. The thermal vias should be connected to the ground plane to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, the device should be operated within the specified temperature range and derating should be applied for high-temperature operation.
  • The device is sensitive to electrostatic discharge (ESD) and should be handled with care. It is recommended to use an ESD wrist strap or mat, and to handle the device by the body rather than the pins. The device should also be stored in an anti-static bag or tube to prevent damage.
  • To troubleshoot issues with the device, it is recommended to follow a systematic approach, starting with a visual inspection of the PCB and device, followed by checking the power supply and input/output signals. The device's datasheet and application notes should be consulted for troubleshooting guidelines and common failure modes.
  • For high-reliability applications, it is essential to follow a rigorous design and testing process, including environmental testing, burn-in, and accelerated life testing. The device should be operated within the specified parameters, and derating should be applied to ensure reliable operation over the required lifetime.

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STCMB1TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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