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STD15N60M2-EP - STMicroelectronics

Description: N-channel 600 V, 0.340 Ohm typ., 11 A MDmesh M2 EP Power MOSFET in a DPAK package

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STD15N60M2-EP - STMicroelectronics - PCB symbol
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STD15N60M2-EP - STMicroelectronics PCB footprint - Other - Other - STD15N60M2-EP-1
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STD15N60M2-EP Details

  • Manufacturer Part Number:

    STD15N60M2-EP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STD15N60M2-EP Frequently Asked Questions (FAQs)

  • The maximum operating junction temperature of the STD15N60M2-EP is 150°C.
  • Yes, the STD15N60M2-EP is suitable for high-frequency switching applications due to its low gate charge and internal gate resistance.
  • The recommended gate drive voltage for the STD15N60M2-EP is between 10V and 15V to ensure proper switching and minimize power losses.
  • Yes, the STD15N60M2-EP can be used in parallel to increase current handling capability, but it's essential to ensure proper gate drive synchronization and thermal management to avoid uneven current sharing.
  • The maximum allowable power dissipation of the STD15N60M2-EP is dependent on the thermal management and cooling system used. However, the maximum power dissipation can be calculated using the thermal resistance and maximum junction temperature ratings provided in the datasheet.

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STD15N60M2-EP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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