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STD26P3LLH6 - STMicroelectronics

Description: P-channel 30 V, 0.024 Ω typ., 12 A, STripFET™ VI DeepGATE™ Power MOSFET in a DPAK package

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PCB Footprints
STD26P3LLH6 - STMicroelectronics PCB footprint - Other - Other - DPAK (TO-252) type A_2025-2
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3D Models
STD26P3LLH6 - STMicroelectronics  - 3D model - Other - DPAK (TO-252) type A_2025-2
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STD26P3LLH6 Details

  • Manufacturer Part Number:

    STD26P3LLH6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    350 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    48 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STD26P3LLH6 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal pads to keep the junction temperature below 150°C. Ensure good airflow and avoid thermal hotspots.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output lines. Implement a robust ESD protection scheme, and ensure that the PCB design follows ESD-safe handling practices.
  • Use a low-dropout regulator (LDO) or a switching regulator with a low output voltage ripple to ensure a stable power supply. Decouple the power supply lines with capacitors and use a ferrite bead or a common-mode choke to filter out noise.
  • Use controlled impedance lines, and terminate them properly to minimize reflections. Use a signal integrity analysis tool to simulate and optimize the signal transmission. Ensure that the PCB layout follows good signal integrity practices.

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STD26P3LLH6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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