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STD5N60DM2 - STMicroelectronics

Description: N-channel 600 V, 1.38 Ω typ., 3.5 A MDmesh™ DM2 Power MOSFET in a DPAK package

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STD5N60DM2 - STMicroelectronics PCB footprint - Other - Other - STD5N60DM2-1
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STD5N60DM2 Details

  • Manufacturer Part Number:

    STD5N60DM2

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    DPAK

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Additional Feature:

    BULK: 2500

  • Avalanche Energy Rating (Eas):

    132 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    1.55 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.5 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    45 W

  • Pulsed Drain Current-Max (IDM):

    14 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STD5N60DM2 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the STD5N60DM2 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the specified maximum ratings and avoid operating conditions that may cause excessive heat, voltage, or current stress.
  • To ensure proper cooling, consider the device's thermal resistance (RthJA) and maximum junction temperature (Tj). Use a heat sink or thermal interface material to reduce thermal resistance, and ensure good airflow around the device. You can also use thermal simulation tools to estimate the device's temperature under various operating conditions.
  • The recommended gate drive voltage for the STD5N60DM2 is typically between 10V to 15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve switching performance, but may also increase power consumption and electromagnetic interference (EMI). Consult the datasheet and application notes for more information.
  • Yes, the STD5N60DM2 is suitable for high-frequency switching applications up to several hundred kHz. However, you should consider the device's switching losses, gate charge, and parasitic capacitances when designing your circuit. You may need to use specialized gate drive circuits and layout techniques to minimize switching losses and ensure reliable operation.
  • To protect the STD5N60DM2 from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. You can also add ESD protection devices, such as TVS diodes or ESD protection arrays, to your circuit to absorb or divert ESD pulses.

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STD5N60DM2 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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