STD70NS04ZL footprint, schematic symbol and 3D model by STMicroelectronics

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STD70NS04ZL - STMicroelectronics PCB footprint - Other - Other - STD70NS04ZL-1

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Part Number STD70NS04ZL
Manufacturer STMicroelectronics
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - STD70NS04ZL-1
Released Date Oct 15, 2021
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STD70NS04ZL Details

Manufacturer Part Number:
STD70NS04ZL
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-252
Package Description:
ROHS COMPLIANT, DPAK-3/2
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
13 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
5
Additional Feature:
AVALANCHE RATED
Avalanche Energy Rating (Eas):
650 mJ
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
33 V
Drain Current-Max (ID):
70 A
Drain-source On Resistance-Max:
0.0125 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
220 pF
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
110 W
Pulsed Drain Current-Max (IDM):
280 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

STD70NS04ZL Frequently Asked Questions (FAQs)

The maximum junction temperature (Tj) for STD70NS04ZL is 150°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 125°C for reliable operation and to prevent thermal runaway.
To calculate the power dissipation of STD70NS04ZL, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance (RthJA). The formula is: Pd = (Vds * Ids) + (RthJA * Tj). You can find the values for Vds, Ids, and RthJA in the datasheet.
To minimize thermal resistance, it's recommended to use a PCB layout with a large copper area connected to the drain pin (D) and a thermal via connecting the drain pin to a heat sink or a copper plane on the other side of the PCB. This helps to dissipate heat efficiently.
While STD70NS04ZL is a high-voltage MOSFET, it's not optimized for high-frequency switching applications. The device has a relatively high gate charge (Qg) and output capacitance (Coss), which can lead to high switching losses. For high-frequency applications, consider using a MOSFET with lower Qg and Coss, such as the STP70NF20 or similar devices.
To protect STD70NS04ZL from overvoltage and overcurrent, consider using a voltage regulator or a voltage clamp to limit the voltage across the device. Additionally, use a current sense resistor and a fuse or a current limiter to prevent overcurrent conditions. You can also use a protection IC, such as the ST's IPD60R1K4P, which provides overvoltage, overcurrent, and thermal protection.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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