STD9N80K5 footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

STD9N80K5 - STMicroelectronics PCB footprint - Other - Other - DPAK (TO-252) type A2_2022-8

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Datasheet Download Datasheet
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Part Number STD9N80K5
Manufacturer STMicroelectronics
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - DPAK (TO-252) type A2_2022-8
Released Date Aug 29, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
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STD9N80K5 Details

Manufacturer Part Number:
STD9N80K5
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
DPAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
14 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
5
Avalanche Energy Rating (Eas):
200 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
800 V
Drain Current-Max (ID):
7 A
Drain-source On Resistance-Max:
0.9 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
0.65 pF
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
110 W
Pulsed Drain Current-Max (IDM):
28 A
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

STD9N80K5 Frequently Asked Questions (FAQs)

The maximum safe operating area (SOA) for the STD9N80K5 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the specified maximum ratings and to ensure that the device does not exceed the maximum junction temperature (Tj) of 175°C.
To ensure the STD9N80K5 is properly biased for optimal performance, follow the recommended biasing scheme outlined in the datasheet. This typically involves setting the gate-source voltage (Vgs) to the recommended value (e.g., 10V) and ensuring that the drain-source voltage (Vds) is within the specified range. Additionally, ensure that the device is properly cooled and that the thermal design is adequate to prevent overheating.
The recommended PCB layout and thermal design for the STD9N80K5 involve using a multi-layer PCB with a solid ground plane, placing the device close to the heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some general guidelines, but it's recommended to consult with a thermal design expert or use thermal simulation software to optimize the design for the specific application.
To protect the STD9N80K5 from electrostatic discharge (ESD), follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Ensure that the device is properly grounded during assembly and that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from static electricity.
The reliability and lifetime expectations for the STD9N80K5 are dependent on various factors, including the operating conditions, quality of the device, and manufacturing process. The datasheet provides some general reliability data, but it's recommended to consult with STMicroelectronics or a reliability expert to determine the expected lifetime and reliability of the device in the specific application.

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STD9N80K5 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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