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STDRIVEG600TR - STMicroelectronics

Description: High voltage half-bridge gate driver for GaN transistors

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STDRIVEG600TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-16_2021
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STDRIVEG600TR - STMicroelectronics  - 3D model - Small Outline Packages - SO-16_2021
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STDRIVEG600TR Details

  • Manufacturer Part Number:

    STDRIVEG600TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED GAN FET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    6 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.4 V

  • Supply Voltage1-Nom:

    6 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

STDRIVEG600TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STDRIVEG600TR is -40°C to 150°C.
  • To ensure proper configuration, refer to the application note AN5323, which provides detailed guidelines for configuring the STDRIVEG600TR for various applications.
  • For optimal performance and thermal management, follow the PCB layout guidelines provided in the datasheet and application note AN5323, and ensure a minimum of 2oz copper thickness and a thermal pad connected to a heat sink or a thermal interface material.
  • Refer to the troubleshooting guide in the application note AN5323, which provides step-by-step procedures for identifying and resolving common issues with the STDRIVEG600TR.
  • Always follow proper safety precautions when handling the STDRIVEG600TR, including wearing protective gear, ensuring a safe working environment, and following proper handling and storage procedures to prevent damage or electrical shock.

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STDRIVEG600TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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