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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for STE750-75T4MI
- Part Number STE750-75T4MI
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
STE750-75T4MI Details
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Manufacturer Part Number:
STE750-75T4MI
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Rohs Code:
No
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Part Life Cycle Code:
Active
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Package Description:
AXIAL LEADED
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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Factory Lead Time:
14 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5
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Additional Feature:
RIPPLE CURRENT IS MEASURED AT 85 DEG CEL
STE750-75T4MI Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the STE750-75T4MI is a pad size of 6.5mm x 5.5mm with a 1.5mm x 1.5mm thermal pad in the center. The pad spacing should be 1.5mm.
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To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads and place the component. Use a reflow oven or a hot air gun to solder the component.
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The maximum allowed voltage derating for the STE750-75T4MI is 80% of the maximum rated voltage. For example, if the maximum rated voltage is 75V, the maximum allowed voltage derating would be 60V.
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The power dissipation of the STE750-75T4MI can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
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The thermal resistance of the STE750-75T4MI is 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case).
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STE750-75T4MI Overview
Use the download button to access the STE750-75T4MI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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