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STF8NM50N - STMicroelectronics

Description: N-channel 500 V, 0.73 Ω, 5 A MDmesh™II Power MOSFET in TO-220FP

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STF8NM50N - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FP_2022
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3D Models
STF8NM50N - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220FP_2022
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STF8NM50N Details

  • Manufacturer Part Number:

    STF8NM50N

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, TO-220FP, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    140 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.79 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.2 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    20 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STF8NM50N Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) for the STF8NM50N is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation and to ensure the device's lifespan.
  • To ensure proper cooling, it's essential to provide a good thermal path from the device to a heat sink or the PCB. Use a thermal interface material (TIM) between the device and the heat sink, and ensure the heat sink is properly attached to the PCB. Additionally, consider using a fan or other cooling mechanism to keep the ambient temperature low.
  • For optimal performance and thermal management, it's recommended to follow a 2-layer or 4-layer PCB layout with a solid ground plane and a separate power plane. Keep the power traces short and wide, and use vias to connect the power planes to the device pins. Also, ensure the PCB material has a high thermal conductivity.
  • Yes, the STF8NM50N is suitable for high-reliability applications. It's designed to meet the requirements of automotive and industrial applications, and it's qualified according to the AEC-Q101 standard. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
  • To protect the STF8NM50N from ESD, follow proper handling and storage procedures. Use an ESD wrist strap or mat when handling the device, and store it in an ESD-protected package. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the device from ESD events.

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STF8NM50N Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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