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STFU16N65M2 - STMicroelectronics

Description: N-channel 650 V, 0.32 Ohm typ., 11 A MDmesh M2 Power MOSFET in TO-220FP ultra narrow leads package

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PCB Footprints
STFU16N65M2 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FP ultra narrow leads _2022
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3D Models
STFU16N65M2 - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220FP ultra narrow leads _2022
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STFU16N65M2 Details

  • Manufacturer Part Number:

    STFU16N65M2

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STFU16N65M2 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the STFU16N65M2 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the specified maximum ratings and avoid operating conditions that may cause excessive heat, voltage, or current stress.
  • To ensure proper biasing, follow the recommended operating conditions and application circuits provided in the datasheet. Pay attention to the gate-source voltage (Vgs) and drain-source voltage (Vds) ratings, and ensure that the device is operated within the specified temperature range. Additionally, consider using a gate driver or voltage regulator to provide a stable and controlled voltage supply.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good heat dissipation, such as using a thermal pad or heat sink. Ensure that the device is mounted on a copper plane or a thermal via to dissipate heat efficiently. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB.
  • To handle ESD protection, follow the recommended handling and storage procedures for the device. Use ESD-protective packaging and handling equipment, and ensure that the device is properly grounded during assembly and testing. Consider using ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design to protect the device from electrostatic discharge.
  • The reliability and lifetime expectations for the STFU16N65M2 are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. Refer to the datasheet for information on the device's reliability and lifetime ratings, such as the mean time to failure (MTTF) and the failure rate. Additionally, consider consulting with STMicroelectronics or a qualified reliability engineer for more detailed information.

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STFU16N65M2 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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