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STG4160BJR - STMicroelectronics

Description: Low voltage 0.5 Ohm single SPDT switch with break-before-make feature and 15 kV ESD protection

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STG4160BJR - STMicroelectronics PCB footprint - Other - Other - STG4160BJR-3
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STG4160BJR Details

  • Manufacturer Part Number:

    STG4160BJR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, FLIP-CHIP-8

  • Pin Count:

    8

  • Country Of Origin:

    Italy

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    1.9 mm

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    77 dB

  • On-state Resistance-Max (Ron):

    3.7 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA8,2X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max (Vsup):

    4.8 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    123 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.9 mm

STG4160BJR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The critical timing parameters include the input-to-output delay (tPD), clock-to-output delay (tCK), and setup/hold times (tSU/tH). Refer to the datasheet for specific values.
  • Implement ESD protection diodes on the input pins, and ensure a robust PCB design with a solid ground plane and ESD protection devices.
  • Power up the device in the following sequence: VCC, then VDD, and finally the input signals. Ensure a monotonic power-up sequence to prevent latch-up.

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STG4160BJR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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