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STGAP1BSTR - STMicroelectronics

Description: Automotive galvanically isolated advanced single gate driver

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STGAP1BSTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO24W-1
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STGAP1BSTR Details

  • Manufacturer Part Number:

    STGAP1BSTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    36 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.13 µs

  • Turn-on Time:

    0.13 µs

  • Width:

    7.5 mm

STGAP1BSTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider derating the device's operating frequency and voltage to prevent overheating.
  • Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads. Store the device in an anti-static bag or tube, and avoid touching the pins or leads during handling.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and identify the issue. Check the power supply, clock, and data signals for errors or noise. Consult the datasheet and application notes for troubleshooting guides.
  • Plan your design to minimize the need for reprogramming, and consider using a programmable device or FPGA if reprogrammability is critical. Use the device's built-in security features to protect your IP and prevent unauthorized access.

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Manufacturer Collaborated
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STGAP1BSTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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