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STGAP2DMTR - STMicroelectronics

Description: Galvanically isolated 4 A half-bridge dual channel gate driver

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STGAP2DMTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO16 Narrow_1
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STGAP2DMTR - STMicroelectronics  - 3D model - Small Outline Packages - SO16 Narrow_1
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STGAP2DMTR Details

  • Manufacturer Part Number:

    STGAP2DMTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    14

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    3.9 mm

STGAP2DMTR Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane, short traces, and minimal vias is recommended. Ensure the device is placed near the center of the PCB to minimize electromagnetic interference (EMI).
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination, pull-up resistors, and clock synchronization. Implement error detection and correction mechanisms to handle data transmission errors.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or thermal pad, and avoid blocking airflow around the device. Monitor the device's temperature and adjust the system design accordingly.
  • Use shielding, filtering, and grounding techniques to minimize EMI. Ensure the device is placed in a shielded area, and use EMI filters on the power supply and signal lines. Follow EMC guidelines and regulations for your specific application.
  • Follow the recommended power-up sequence: VCC, then VDD, and finally the input signals. Ensure a slow voltage ramp-up (typically 1-10 ms) to prevent damage to the device.

Trust Checks

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Manufacturer Collaborated
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STGAP2DMTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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