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STGAP2SMTR - STMicroelectronics

Description: Gate Drivers Galvanically isolated 4 A single gate driver

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STGAP2SMTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8[H=1.75mm]
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3D Models
STGAP2SMTR - STMicroelectronics  - 3D model - Small Outline Packages - SO-8[H=1.75mm]
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STGAP2SMTR Details

  • Manufacturer Part Number:

    STGAP2SMTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Date Of Intro:

    2018-07-24

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    14

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    26 V

  • Supply Voltage1-Min:

    9.6 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.12 µs

  • Turn-on Time:

    0.12 µs

  • Width:

    3.9 mm

STGAP2SMTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a shielded cable for the Gigabit Ethernet interface.
  • Implement a proper thermal management system, such as a heat sink or a fan, to keep the junction temperature below 125°C. Also, ensure good airflow around the device and avoid blocking the thermal pads.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. The voltage ramp-up time should be slower than 10 ms/V to prevent latch-up and ensure reliable operation.
  • Use a protocol analyzer to capture and analyze the Ethernet packets. Check the link status, packet transmission, and reception rates. Verify the correct configuration of the MAC and PHY layers, and ensure that the clock signals are properly routed.
  • Use a shielded enclosure, ensure good grounding, and keep the high-frequency signals away from the enclosure walls. Implement EMI filters on the power lines and use a common-mode choke on the Gigabit Ethernet interface.

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STGAP2SMTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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