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STGIPNS3H60T-H - STMicroelectronics

Description: IGBT Modules SLLIMM-nano small low-loss intelligent molded module IPM, 3 A, 600 V 3-phase IGBT inverter bridge

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STGIPNS3H60T-H - STMicroelectronics - PCB symbol
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STGIPNS3H60T-H - STMicroelectronics PCB footprint - Other - Other - STGIPNS3H60T-H-4
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STGIPNS3H60T-H Details

  • Manufacturer Part Number:

    STGIPNS3H60T-H

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    NSDIP-26

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-G26

  • Length:

    29.15 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,26LEAD,.67

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    3.45 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Width:

    12.45 mm

STGIPNS3H60T-H Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STGIPNS3H60T-H is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface materials, and airflow management.
  • The recommended gate drive voltage for the STGIPNS3H60T-H is between 10V to 15V, with a maximum voltage of 20V.
  • To protect the device, use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) mechanism, such as a fuse or a current-sensing resistor.
  • Follow the recommended PCB layout and thermal design guidelines provided in the application note AN5042 from STMicroelectronics, which includes guidelines for thermal vias, copper pours, and heat sink attachment.

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STGIPNS3H60T-H Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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