Part Image

STH270N8F7-6 - STMicroelectronics

Description: N-channel 80 V, 0.0017 Ω typ., 180 A STripFET F7 Power MOSFETs in an H²PAK-2, H²PAK-6 and TO-220 packages

Download STH270N8F7-6 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
STH270N8F7-6 - STMicroelectronics PCB footprint - Other - Other - H²PAK-6
click to zoom
3D Models
STH270N8F7-6 - STMicroelectronics  - 3D model - Other - H²PAK-6
click to zoom

STH270N8F7-6 Details

  • Manufacturer Part Number:

    STH270N8F7-6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.9

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    1160 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    180 A

  • Drain-source On Resistance-Max:

    0.0021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STH270N8F7-6 Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions and derating guidelines in the datasheet.
  • The STH270N8F7-6 has built-in ESD protection and latch-up prevention mechanisms, but it's still recommended to follow proper handling and assembly procedures to prevent damage.
  • Yes, the STH270N8F7-6 is qualified for automotive and high-reliability applications, but additional testing and validation may be required depending on the specific use case.
  • Use a combination of visual inspection, signal analysis, and debugging techniques to identify the root cause of the issue, and consult STMicroelectronics' application notes and support resources as needed.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

STH270N8F7-6 Overview

Use the download button to access the STH270N8F7-6 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STH27, or try a keyword search, such as Power Field-Effect Transistors

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

Parts related to STH270N8F7-6

Showing 0 results