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STL13NM60N - STMicroelectronics

Description: N-channel 600 V, 0.320 Ohm typ., 10 A MDmesh(TM) II Power MOSFET in PowerFLAT(TM) 8x8 HV package

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STL13NM60N - STMicroelectronics - PCB symbol
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PCB Footprints
STL13NM60N - STMicroelectronics PCB footprint - Other - Other - PowerFLAT™ 8x8 HV_2022-1
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3D Models
STL13NM60N - STMicroelectronics - 3D model - Other - PowerFLAT™ 8x8 HV_2022-1
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STL13NM60N Details

  • Manufacturer Part Number:

    STL13NM60N

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    8 X 8 MM, ROHS COMPLIANT, POWER FLAT-5

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    93 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    1.9 A

  • Drain-source On Resistance-Max:

    0.385 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    7.6 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STL13NM60N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STL13NM60N is -40°C to 150°C.
  • To ensure proper biasing, the STL13NM60N requires a VCC voltage of 1.71V to 1.89V and a VBB voltage of 1.71V to 1.89V. Additionally, the device requires a bias current of 100μA to 200μA.
  • For optimal thermal management, it is recommended to use a 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer. Additionally, a thermal via array can be used to improve heat dissipation.
  • To ensure ESD protection, it is recommended to use a human body model (HBM) ESD protection circuit with a minimum of 2kV rating. Additionally, it is recommended to use a charged device model (CDM) ESD protection circuit with a minimum of 500V rating.
  • The recommended soldering conditions for the STL13NM60N are a peak temperature of 260°C, a dwell time of 30 seconds, and a soldering process that meets the IPC J-STD-020 standard.

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STL13NM60N Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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