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STL20NF06LAG - STMicroelectronics

Description: Automotive-grade N-channel 60 V, 27 mΩ typ., 20 A STripFET™ II Power MOSFET in a PowerFLAT™ 5x6 package

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STL20NF06LAG - STMicroelectronics - PCB symbol
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PCB Footprints
STL20NF06LAG - STMicroelectronics PCB footprint - Other - Other - PowerFLAT ™ 5x6 WF type R
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3D Models
STL20NF06LAG - STMicroelectronics - 3D model - Other - PowerFLAT ™ 5x6 WF type R
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STL20NF06LAG Details

  • Manufacturer Part Number:

    STL20NF06LAG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    210 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    56 pF

  • JESD-30 Code:

    R-PDSO-F5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    75 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STL20NF06LAG Frequently Asked Questions (FAQs)

  • The maximum junction temperature of the STL20NF06LAG is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
  • To ensure proper cooling, it's essential to provide a good thermal path from the device to a heat sink or the PCB. Use a thermal interface material (TIM) between the device and the heat sink, and ensure the heat sink is properly attached to the device. Additionally, consider using a thermal pad or thermal tape to improve heat dissipation.
  • For optimal performance and thermal management, it's recommended to follow a 2-layer or 4-layer PCB layout with a solid ground plane and a separate power plane. Keep the high-current paths short and wide, and use vias to connect the top and bottom layers. Avoid routing high-frequency signals near the device to minimize electromagnetic interference (EMI).
  • Yes, the STL20NF06LAG is suitable for high-reliability applications. STMicroelectronics provides a range of reliability data, including FIT rates and MTBF calculations, to support the device's use in demanding applications. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the device meets the required reliability standards.
  • To handle the high inrush current during startup, consider using a soft-start circuit or a current limiter to reduce the inrush current. You can also use a NTC thermistor or a PTC resistor to limit the inrush current. Additionally, ensure the power supply can handle the high inrush current and that the device is properly decoupled to prevent voltage droop.

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STL20NF06LAG Overview

Use the download button to access the STL20NF06LAG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STL20, or try a keyword search, such as Power Field-Effect Transistors

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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