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STL38DN6F7AG - STMicroelectronics

Description: Automotive-grade N-channel 60 V, 24 mΩ typ., 10 A STripFET™ F7 Power MOSFET in a PowerFLAT™ 5x6 double island package

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STL38DN6F7AG - STMicroelectronics - PCB symbol
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PCB Footprints
STL38DN6F7AG - STMicroelectronics PCB footprint - Other - Other - PowerFLAT 5x6 double island WF_2022
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3D Models
STL38DN6F7AG - STMicroelectronics - 3D model - Other - PowerFLAT 5x6 double island WF_2022
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STL38DN6F7AG Details

  • Manufacturer Part Number:

    STL38DN6F7AG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.55

  • Additional Feature:

    BULK: 3000

  • Avalanche Energy Rating (Eas):

    50 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7.9 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    57.7 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STL38DN6F7AG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Monitor the device's junction temperature (TJ) to prevent thermal runaway.
  • Handle the device by the body, avoiding touching the pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Check the input voltage, output voltage, and load current. Verify that the device is properly configured and that the output capacitor is suitable for the application. Check for any signs of overheating or thermal shutdown.
  • Use a shielded enclosure and ensure good grounding practices. Use a common-mode choke or ferrite bead to filter out high-frequency noise. Follow the recommended PCB layout and component placement guidelines to minimize EMI radiation.

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STL38DN6F7AG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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