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STL75N3LLZH5 - STMicroelectronics

Description: N-channel 30 V, 0.0055 Ω, 19 A PowerFLAT™ (5x6) STripFET™ V Power MOSFET

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STL75N3LLZH5 - STMicroelectronics - PCB symbol
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PCB Footprints
STL75N3LLZH5 - STMicroelectronics PCB footprint - Other - Other - PowerFLAT™ 5x6_2010
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3D Models
STL75N3LLZH5 - STMicroelectronics - 3D model - Other - PowerFLAT™ 5x6_2010
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STL75N3LLZH5 Details

  • Manufacturer Part Number:

    STL75N3LLZH5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    6 X 5 MM, ROHS COMPLIANT, POWERFLAT-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    19 A

  • Drain-source On Resistance-Max:

    0.0078 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Pulsed Drain Current-Max (IDM):

    76 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STL75N3LLZH5 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Monitor the device's thermal status using the built-in thermal sensor.
  • Use a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed as close as possible to the device's power pins. Add a 100nF ceramic capacitor for each power domain.
  • Use the device's low-power modes, such as sleep or standby, whenever possible. Optimize the system's clock frequency and voltage scaling to minimize power consumption.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on the power supply and I/O lines. Follow the guidelines in the STMicroelectronics application note AN2679 for EMI and EMC compliance.

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STL75N3LLZH5 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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