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STM32C011F4P3 - STMicroelectronics

Description: • Includes ST state-of-the-art patented technology • Core: Arm® 32-bit Cortex®-M0+ CPU, frequency up to 48 MHz • -40°C to 85°C/105°C/125°C operating temperature • Memories – Up to 32 Kbytes of flash memory with protection – 6 Kbytes of SRAM with hardware parity check • CRC calculation unit • Reset and power management – Voltage range: 2.0 V to 3.6 V – Power-on / power-down reset (POR/PDR) – Programmable brownout reset (BOR) – Low-power modes: Sleep, Stop, Standby, Shutdown • Clock manageme

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STM32C011F4P3 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-20
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STM32C011F4P3 Details

  • Manufacturer Part Number:

    STM32C011F4P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    3

  • Number of External Interrupts:

    18

  • Number of I/O Lines:

    18

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • RAM (bytes):

    6144

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    4.9 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32C011F4P3 Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with the internal oscillator is 64 MHz, but it requires calibration and is only guaranteed for a temperature range of 0°C to 85°C.
  • To achieve the highest performance, you should use the HSE (High-Speed External) clock source, and configure the PLL (Phase-Locked Loop) to multiply the clock frequency. You can use the STM32CubeMX tool to generate the clock configuration code.
  • The minimum voltage required for the device to operate is 2.0 V, but it's recommended to use a voltage of at least 2.4 V to ensure reliable operation.
  • To use the DMA controller, you need to configure the DMA channel, set the source and destination addresses, and enable the DMA transfer. You can use the STM32CubeMX tool to generate the DMA configuration code. Additionally, you can use the DMA to transfer data between peripherals, such as SPI, I2C, and UART.
  • The maximum amount of current that can be sourced or sunk by the GPIO pins is 20 mA, but it's recommended to limit the current to 10 mA to ensure reliable operation and prevent overheating.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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