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STM32F302RET7 - STMicroelectronics

Description: Mainstream Mixed signals MCUs Arm Cortex-M4 core with DSP and FPU, 512 Kbytes of Flash memory, 72 MHz CPU, MPU, 12-bit ADC 5 MSPS, PGA, comparators

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STM32F302RET7 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP64_2024
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STM32F302RET7 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP64_2024
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STM32F302RET7 Details

  • Manufacturer Part Number:

    STM32F302RET7

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    10 X 10 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-64

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    51

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    72 MHz

  • Supply Current-Max:

    77.4 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn) - immersion

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F302RET7 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32F302RET7 is 72 MHz, which can be achieved using an external clock source or the internal high-speed clock (HSI).
  • The clock settings for the STM32F302RET7 can be configured using the Clock Control Register (RCC) and the Power Control Register (PWR). The RCC register is used to select the clock source, while the PWR register is used to configure the voltage regulator and power modes.
  • The BOOT0 and BOOT1 pins on the STM32F302RET7 are used to select the boot mode of the device. BOOT0 is used to select between the internal flash memory and an external memory, while BOOT1 is used to select between the boot loader and the user application.
  • The DMA controller on the STM32F302RET7 can be used to transfer data between peripherals and memory without involving the CPU. The DMA controller is configured using the DMA_CCRx and DMA_Sx registers, and the transfer is triggered by a peripheral request or a software trigger.
  • The main difference between the STM32F302RET7 and the STM32F303RET7 is the amount of flash memory and SRAM. The STM32F302RET7 has 512 KB of flash memory and 64 KB of SRAM, while the STM32F303RET7 has 512 KB of flash memory and 128 KB of SRAM.

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STM32F302RET7 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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