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STM32F405OGY6WTR - STMicroelectronics

Description: Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera

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PCB Footprints
STM32F405OGY6WTR - STMicroelectronics PCB footprint - BGA - BGA - WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch
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3D Models
STM32F405OGY6WTR - STMicroelectronics  - 3D model - BGA - WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch
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STM32F405OGY6WTR Details

  • Manufacturer Part Number:

    STM32F405OGY6WTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-90

  • Manufacturer Package Code:

    WLCSP 90 BALLS DIE 413 P 0.4 MM

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PBGA-B90

  • Length:

    4.223 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    72

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    90

  • Number of Timers:

    14

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA90,9X10,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    200704

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.6 mm

  • Speed:

    168 MHz

  • Supply Current-Max:

    117 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.969 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F405OGY6WTR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32F405OGY6WTR is -40°C to 105°C (industrial grade) and -40°C to 125°C (extended grade).
  • The clock speed of the STM32F405OGY6WTR can be configured using the Clock Control Register (RCC) and the Power Management Unit (PMU). You can use the STM32CubeMX tool or write code to configure the clock speed.
  • The maximum current consumption of the STM32F405OGY6WTR depends on the operating frequency and voltage. At 180 MHz and 3.3V, the maximum current consumption is around 350 mA.
  • The DMA controller on the STM32F405OGY6WTR can be used to transfer data between peripherals and memory. You need to configure the DMA channel, set the transfer mode, and enable the DMA interrupt. You can use the STM32CubeMX tool or write code to configure the DMA controller.
  • The BOOT0 and BOOT1 pins on the STM32F405OGY6WTR are used to select the boot mode of the device. BOOT0 is used to select between the internal flash and the system memory, while BOOT1 is used to select between the internal flash and an external memory.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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