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STM32F745VEH6 - STMicroelectronics

Description: ARM®-based Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 1MB Flash/320+16+ 4KB RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD

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PCB Footprints
STM32F745VEH6 - STMicroelectronics PCB footprint - BGA - BGA - TFBGA100, 8 x 8 x 0.8 mm
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3D Models
STM32F745VEH6 - STMicroelectronics  - 3D model - BGA - TFBGA100, 8 x 8 x 0.8 mm
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STM32F745VEH6 Details

  • Manufacturer Part Number:

    STM32F745VEH6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-100

  • Manufacturer Package Code:

    TFBGA 8X8 100L F10X10 0.8 MM PIT

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    82

  • Number of Serial I/Os:

    10

  • Number of Terminals:

    100

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA100,10X10,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    348160

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    216 MHz

  • Supply Current-Max:

    261 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F745VEH6 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32F745VEH6 is 216 MHz.
  • The clock settings for the STM32F745VEH6 can be configured using the Clock Configuration Tool (CCT) software provided by STMicroelectronics or by writing custom code using the STM32CubeF7 firmware package.
  • The BOOT0 and BOOT1 pins are used to select the boot mode of the microcontroller. BOOT0 is used to select between the internal flash and the system memory, while BOOT1 is used to select between the internal flash and the external memory.
  • The DMA controller on the STM32F745VEH6 can be used to transfer data between peripherals and memory without CPU intervention. This can be done by configuring the DMA channels, setting the transfer parameters, and enabling the DMA transfer.
  • The NVIC is used to handle interrupts generated by peripherals and other sources. It allows the microcontroller to prioritize and handle interrupts efficiently, ensuring that the system responds quickly to events.

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STM32F745VEH6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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