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STM32F746NEH6 - STMicroelectronics

Description: ARM®-based Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 1MB Flash/320+16+ 4KB RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD

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PCB Footprints
STM32F746NEH6 - STMicroelectronics PCB footprint - BGA - BGA - TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
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STM32F746NEH6 - STMicroelectronics  - 3D model - BGA - TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
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STM32F746NEH6 Details

  • Manufacturer Part Number:

    STM32F746NEH6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-216

  • Manufacturer Package Code:

    TFBGA 13X13X1.2 216L P 0.8 MM

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B216

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    168

  • Number of Serial I/Os:

    10

  • Number of Terminals:

    216

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA216,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    348160

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    216 MHz

  • Supply Current-Max:

    261 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F746NEH6 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32F746NEH6 is 216 MHz, but it can be overclocked to 240 MHz with some limitations.
  • The clock tree in the STM32F746NEH6 can be configured using the Clock Configuration Tool (CCT) in STM32CubeMX, which is a graphical software configuration tool.
  • The VBAT pin is used to supply power to the real-time clock (RTC) and the backup registers when the device is in power-down mode or when the main power supply is turned off.
  • The DMA controller in the STM32F746NEH6 can be used to transfer data between peripherals and memory without CPU intervention. It can be configured using the DMA_CCRx registers and the DMA_SxCR registers.
  • The main difference between the STM32F746NEH6 and the STM32F746NGH6 is the package type. The STM32F746NEH6 is available in a LQFP144 package, while the STM32F746NGH6 is available in a BGA176 package.

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STM32F746NEH6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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