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STM32F767VGT6 - STMicroelectronics

Description: Arm® Cortex®-M7 32b MCU+FPU, 462 DMIPS, up to 2 MB flash, 512+16+4 KB RAM, USB OTG HS/FS, 28 com. int., LCD, DSI

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STM32F767VGT6 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline
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STM32F767VGT6 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline
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STM32F767VGT6 Details

  • Manufacturer Part Number:

    STM32F767VGT6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-100

  • Manufacturer Package Code:

    LQFP 100 14x14x1.4

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    8

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    82

  • Number of Terminals:

    100

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    544768

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    216 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F767VGT6 Frequently Asked Questions (FAQs)

  • The maximum frequency of the STM32F767VGT6 is 216 MHz, but it can be overclocked to 240 MHz with a reduced voltage.
  • The clock tree in the STM32F767VGT6 can be configured using the Clock Configuration Tool (CCT) in STM32CubeMX, which generates the necessary code for the clock setup.
  • The VBAT pin is used to supply power to the real-time clock (RTC) and the backup registers when the device is in power-down mode or when the main power supply is turned off.
  • The DMA controller in the STM32F767VGT6 can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller is configured using the DMA_CCRx registers and the DMA_SxCR registers.
  • The main difference between the STM32F767VGT6 and the STM32F767ZGT6 is the package type. The STM32F767VGT6 is available in a LQFP100 package, while the STM32F767ZGT6 is available in a LQFP144 package.

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STM32F767VGT6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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