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STM32F779AIY6TR - STMicroelectronics

Description: Arm® Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 2MB flash, 512+16+4KB RAM, crypto, USB OTG HS/FS, 28 com IF, LCD, DSI

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STM32F779AIY6TR - STMicroelectronics PCB footprint - BGA - BGA - WLCSP180
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STM32F779AIY6TR - STMicroelectronics  - 3D model - BGA - WLCSP180
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STM32F779AIY6TR Details

  • Manufacturer Part Number:

    STM32F779AIY6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-180

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    R-PBGA-B180

  • Length:

    6.095 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    128

  • Number of Serial I/Os:

    12

  • Number of Terminals:

    180

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA180,13X14,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    524288

  • RAM (words):

    262144

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.585 mm

  • Speed:

    216 MHz

  • Supply Current-Max:

    258 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time-Min:

    SECONDS

  • Width:

    5.537 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F779AIY6TR Frequently Asked Questions (FAQs)

  • The STM32F779AIY6TR can operate in a temperature range of -40°C to 85°C (industrial grade) or -40°C to 125°C (extended grade).
  • The clock speed of the STM32F779AIY6TR can be configured using the Clock Control Register (RCC) and the Power Control Register (PWR). The clock speed can be set to 32 kHz, 4 MHz, 8 MHz, 16 MHz, 24 MHz, 32 MHz, 48 MHz, or 216 MHz.
  • The STM32F779AIY6TR has 512 KB of RAM and 2 MB of Flash memory.
  • The DMA controller on the STM32F779AIY6TR can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller has 16 channels and supports various transfer modes, including circular buffer mode and double buffer mode.
  • The STM32F779AIY6TR has several low-power modes, including Sleep mode, Stop mode, and Standby mode. Sleep mode reduces power consumption by stopping the CPU clock, while Stop mode reduces power consumption by stopping the CPU clock and peripherals. Standby mode reduces power consumption by stopping the CPU clock, peripherals, and voltage regulators.

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STM32F779AIY6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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