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STM32G0B1KBT3 - STMicroelectronics

Description: Mainstream Arm Cortex-M0+ 32-bit MCU, up to 128KB Flash, 144KB RAM, 6x USART, timers, ADC, DAC, comm. I/Fs, 1.7-3.6V

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STM32G0B1KBT3 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP - 32-pin, 7 x 7 mm
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STM32G0B1KBT3 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP - 32-pin, 7 x 7 mm
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STM32G0B1KBT3 Details

  • Manufacturer Part Number:

    STM32G0B1KBT3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-32

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Additional Feature:

    2-ch internal adc available

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G32

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    12

  • Number of I/O Lines:

    24

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    32

  • Number of Timers:

    17

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    147456

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    9.9 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn) - immersion

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32G0B1KBT3 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32G0B1KBT3 is 64 MHz, but it can be overclocked to 72 MHz with a reduced voltage range.
  • The internal oscillator (HSI) on the STM32G0B1KBT3 can be configured using the RCC_ICSCR register. The HSI is enabled by setting the HSION bit in the RCC_CR register, and the frequency can be trimmed using the RCC_ICSCR register.
  • The maximum current consumption of the STM32G0B1KBT3 depends on the operating mode and frequency. According to the datasheet, the maximum current consumption is around 350 mA at 64 MHz with all peripherals enabled.
  • The DMA controller on the STM32G0B1KBT3 can be used to transfer data between peripherals and memory. The DMA is configured using the DMA_CCRx registers, and the transfer is triggered by setting the DMA_EN bit in the DMA_CCRx register.
  • The BOOT0 and BOOT1 pins on the STM32G0B1KBT3 are used to select the boot mode of the device. BOOT0 is used to select between the internal flash and the system memory, while BOOT1 is used to select between the internal flash and an external memory.

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STM32G0B1KBT3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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