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STM32G0B1MET6 - STMicroelectronics

Description: Arm® Cortex®-M0+ 32-bit MCU, up to 512KB Flash, 144KB RAM, 6x USART, timers, ADC, DAC, comm. I/Fs, 1.7-3.6V

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STM32G0B1MET6 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP80 12 x 12 mm 80 pin low-profile quad flat package
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STM32G0B1MET6 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP80 12 x 12 mm 80 pin low-profile quad flat package
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STM32G0B1MET6 Details

  • Manufacturer Part Number:

    STM32G0B1MET6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-80

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Additional Feature:

    3-ch internal adc available

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    12

  • Number of I/O Lines:

    74

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    80

  • Number of Timers:

    17

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP80,.55SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    147456

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    9.4 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32G0B1MET6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32G0B1MET6 is -40°C to 125°C, but it can be extended to -40°C to 150°C for some specific packages and with some limitations.
  • The clock system on the STM32G0B1MET6 can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics, or by writing code to configure the registers directly. The RCC (Reset and Clock Control) peripheral is used to configure the clock system.
  • The maximum frequency of the STM32G0B1MET6 is 64 MHz, but it can be overclocked to 72 MHz with some limitations.
  • The DMA controller on the STM32G0B1MET6 can be used to transfer data between peripherals and memory without involving the CPU. The DMA controller is configured using the DMA_CCRx (DMA Channel x Configuration Register) and DMA_SxCRx (DMA Stream x Configuration Register) registers.
  • The power consumption of the STM32G0B1MET6 depends on the operating frequency, voltage, and peripherals used. The datasheet provides typical power consumption values for different operating modes, such as Sleep, Stop, and Run modes.

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STM32G0B1MET6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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