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STM32G473VEH6TR - STMicroelectronics

Description: Arm® Cortex®-M4 32-bit MCU+FPU, up to 512 KB Flash, 170 MHz / 213DMIPS, 128 KB SRAM, rich analog, math accelerator

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STM32G473VEH6TR - STMicroelectronics PCB footprint - BGA - BGA - TFBGA 100 8x8x1.2 P 0.8 m
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STM32G473VEH6TR - STMicroelectronics  - 3D model - BGA - TFBGA 100 8x8x1.2 P 0.8 m
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STM32G473VEH6TR Details

  • Manufacturer Part Number:

    STM32G473VEH6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-100

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2019-05-27

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    11

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    86

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    100

  • Number of Timers:

    14

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA100,10X10,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    131072

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    170 MHz

  • Supply Current-Max:

    42 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32G473VEH6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32G473VEH6TR is -40°C to 125°C, but it can be extended to -40°C to 150°C for some specific packages and with some limitations.
  • The clock system on the STM32G473VEH6TR can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics, or by writing custom code using the STM32CubeG4 firmware package.
  • The maximum frequency of the STM32G473VEH6TR's core is 170 MHz, and the maximum frequency of its peripherals varies depending on the peripheral, but is typically in the range of 80-170 MHz.
  • The STM32G473VEH6TR's DMA controller can be used to transfer data between peripherals and memory without CPU intervention. This is done by configuring the DMA channels, setting up the transfer parameters, and enabling the DMA transfer.
  • The power consumption of the STM32G473VEH6TR depends on the operating frequency, voltage, and peripherals used. The typical power consumption is around 350 μA/MHz in Run mode, but can be as low as 20 μA in Stop mode.

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STM32G473VEH6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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