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STM32H725AGI3 - STMicroelectronics

Description: High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, external memory interface, SMPS, subset of peripherals

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PCB Footprints
STM32H725AGI3 - STMicroelectronics PCB footprint - BGA - BGA - UFBGA - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
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3D Models
STM32H725AGI3 - STMicroelectronics  - 3D model - BGA - UFBGA - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
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STM32H725AGI3 Details

  • Manufacturer Part Number:

    STM32H725AGI3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UFBGA-169

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B169

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    121

  • Number of Serial I/Os:

    14

  • Number of Terminals:

    169

  • Number of Timers:

    24

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA169,13X13,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • RAM (bytes):

    577536

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.6 mm

  • Speed:

    550 MHz

  • Supply Current-Max:

    360 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32H725AGI3 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32H725AGI3 is -40°C to 125°C (junction temperature). However, it's recommended to operate within -40°C to 85°C for optimal performance and reliability.
  • The clock system can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics. The tool helps to generate the optimal clock configuration based on the application requirements. Additionally, the STM32CubeMX software can also be used to configure the clock system.
  • The maximum frequency for the Cortex-M7 core in the STM32H725AGI3 is 550 MHz. However, the actual frequency may vary depending on the voltage and temperature conditions.
  • The ART accelerator is used to accelerate the execution of certain instructions. To use the ART accelerator, the application code needs to be compiled with the ART option enabled. Additionally, the ART accelerator can be configured using the STM32CubeMX software.
  • The STM32H725AGI3 has up to 1 MB of Flash memory and up to 564 KB of SRAM. However, the actual amount of memory available may vary depending on the specific device and configuration.

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STM32H725AGI3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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