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STM32H735VGY6TR - STMicroelectronics

Description: High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, external memory interface, SMPS, subset of peripherals including a Crypto accelerator

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STM32H735VGY6TR - STMicroelectronics PCB footprint - Other - Other - WLCSP115 3.73x4.15x0.35mm
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STM32H735VGY6TR - STMicroelectronics  - 3D model - Other - WLCSP115 3.73x4.15x0.35mm
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STM32H735VGY6TR Details

  • Manufacturer Part Number:

    STM32H735VGY6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-115

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    R-PBGA-B115

  • Length:

    4.15 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    67

  • Number of Serial I/Os:

    12

  • Number of Terminals:

    115

  • Number of Timers:

    27

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA115,11X21,14

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    577536

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.58 mm

  • Speed:

    550 MHz

  • Supply Current-Max:

    360 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3.73 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32H735VGY6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32H735VGY6TR is -40°C to 125°C (junction temperature). However, the recommended operating temperature range is -40°C to 85°C for optimal performance and reliability.
  • The clock system on the STM32H735VGY6TR can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics. The CCT allows you to select the clock sources, configure the clock dividers, and generate the clock configuration code for your application.
  • The maximum frequency of the Cortex-M7 processor core on the STM32H735VGY6TR is 550 MHz. However, the actual operating frequency may be lower depending on the clock configuration and the application requirements.
  • The ART Accelerator on the STM32H735VGY6TR is a cache-based accelerator that can improve the performance of certain algorithms. To use the ART Accelerator, you need to enable it in the system configuration, allocate the accelerator memory, and use the ART-specific instructions in your code.
  • The STM32H735VGY6TR has up to 1 MB of Flash memory and up to 564 KB of SRAM. Additionally, it has 256 KB of Tightly-Coupled Memory (TCM) for data and instructions.

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STM32H735VGY6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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