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STM32H745BGT6 - STMicroelectronics

Description: High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 1MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals, SMPS

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STM32H745BGT6 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-208
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STM32H745BGT6 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP-208
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STM32H745BGT6 Details

  • Manufacturer Part Number:

    STM32H745BGT6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-208

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G208

  • Length:

    28 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    148

  • Number of Serial I/Os:

    11

  • Number of Terminals:

    208

  • Number of Timers:

    22

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    1048576

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    480 MHz

  • Supply Current-Max:

    462 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32H745BGT6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32H745BGT6 is -40°C to 125°C (junction temperature). However, the recommended operating temperature range is -40°C to 85°C for optimal performance and reliability.
  • The clock system on the STM32H745BGT6 can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics. The CCT is a graphical tool that allows you to configure the clock tree and generate the corresponding code for your application.
  • The maximum frequency of the Cortex-M7 core on the STM32H745BGT6 is 480 MHz. However, the actual frequency may vary depending on the clock configuration and the application requirements.
  • The ART Accelerator on the STM32H745BGT6 is a cache-based accelerator that can improve the performance of certain algorithms. To use the ART Accelerator, you need to enable it in the system configuration and use the optimized libraries provided by STMicroelectronics.
  • The STM32H745BGT6 has up to 1 MB of Flash memory and up to 864 KB of SRAM. Additionally, it has 256 KB of TCM (Tightly-Coupled Memory) RAM for data and instruction caching.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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