STM32H755XIH6TR - STMicroelectronics

STM32H755XIH6TR Details

• Manufacturer Part Number:

  STM32H755XIH6TR

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-265

• Country Of Origin:

  Malaysia, Philippines

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  15 Weeks

• Manufacturer:

  STMicroelectronics

• YTEOL:

  9

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M4/M7

• Clock Frequency-Max:

  48 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B265

• JESD-609 Code:

  e1

• Length:

  14 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  4

• Number of I/O Lines:

  168

• Number of Serial I/Os:

  11

• Number of Terminals:

  265

• Number of Timers:

  28

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA265,17X17,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  1085440

• ROM (words):

  2097152

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.2 mm

• Speed:

  480 MHz

• Supply Current-Max:

  462 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  14 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC