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STM32H7B3VIH6 - STMicroelectronics

Description: 32-bit Arm® Cortex®-M7 280 MHz MCUs, 2-Mbyte flash memory, 1.4-Mbyte RAM, 46 com. and analog interfaces, SMPS, crypto

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STM32H7B3VIH6 - STMicroelectronics PCB footprint - BGA - BGA - TFBGA 100 PIN
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STM32H7B3VIH6 - STMicroelectronics  - 3D model - BGA - TFBGA 100 PIN
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STM32H7B3VIH6 Details

  • Manufacturer Part Number:

    STM32H7B3VIH6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-03-19

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    STM32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    5

  • Number of I/O Lines:

    80

  • Number of Terminals:

    100

  • Number of Timers:

    18

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA100,10X10,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (words):

    1413120

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.1 mm

  • Speed:

    280 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32H7B3VIH6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32H7B3VIH6 is -40°C to 125°C (junction temperature). However, the recommended operating temperature range is -40°C to 85°C for optimal performance and reliability.
  • The clock system can be configured using the Clock Configuration Tool (CCT) provided by STMicroelectronics. The tool helps to generate the optimal clock configuration based on the application requirements. Additionally, the STM32CubeMX software can also be used to configure the clock system.
  • The maximum frequency of the Cortex-M7 core in the STM32H7B3VIH6 is 480 MHz. However, the actual frequency may vary depending on the voltage and temperature conditions.
  • The dual-bank flash memory can be used to implement a firmware update mechanism. One bank can be used to store the current firmware, while the other bank can be used to store the new firmware. The STM32CubeMX software provides an example of how to use the dual-bank flash memory for firmware updates.
  • The STM32H7B3VIH6 has a total of 1 MB of RAM, but some of it is reserved for the system and peripherals. The maximum amount of RAM available for the application is around 768 KB, depending on the configuration and peripherals used.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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