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STM32L011E3Y6TR - STMicroelectronics

Description: Access line ultra-low-power 32-bit MCU Arm®-based Cortex®-M0+, up to 16KB Flash, 2KB SRAM, 512B EEPROM, ADC

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STM32L011E3Y6TR - STMicroelectronics PCB footprint - BGA - BGA - WLCSP25-1
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STM32L011E3Y6TR - STMicroelectronics  - 3D model - BGA - WLCSP25-1
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STM32L011E3Y6TR Details

  • Manufacturer Part Number:

    STM32L011E3Y6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-25

  • Manufacturer Package Code:

    WLCSP 25L DIE 457 P 0.4

  • Country Of Origin:

    Singapore

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PBGA-B25

  • Length:

    2.133 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    5

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    21

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    25

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    2048

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.585 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.07 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32L011E3Y6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32L011E3Y6TR is -40°C to 85°C (industrial grade) and -40°C to 125°C (extended grade).
  • The internal clock source can be configured using the Clock Security System (CSS) and the Power Management Unit (PMU) registers. The HSE (High-Speed External) clock, LSE (Low-Speed External) clock, HSI (High-Speed Internal) clock, and LSI (Low-Speed Internal) clock can be used as clock sources.
  • The maximum current consumption of the STM32L011E3Y6TR depends on the operating mode and frequency. In Run mode, the maximum current consumption is around 350 μA/MHz at 32 MHz with all peripherals enabled. In Low Power Run mode, the maximum current consumption is around 150 μA/MHz at 32 MHz with all peripherals enabled.
  • The ADC on the STM32L011E3Y6TR can be used by configuring the ADC clock, enabling the ADC peripheral, selecting the ADC channel, and starting the ADC conversion. The ADC result can be read from the ADC data register.
  • Yes, the STM32L011E3Y6TR can be used with an external crystal oscillator. The external crystal oscillator can be connected to the OSC_IN and OSC_OUT pins, and the HSE clock can be enabled to use the external crystal oscillator as the clock source.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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