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STM32L151ZCT6TR - STMicroelectronics

Description: Ultra-low-power 32-bit MCU Arm®-based Cortex®-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC

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STM32L151ZCT6TR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144-2
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STM32L151ZCT6TR - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP144-2
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STM32L151ZCT6TR Details

  • Manufacturer Part Number:

    STM32L151ZCT6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M3

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    12

  • Number of I/O Lines:

    115

  • Number of Terminals:

    144

  • Number of Timers:

    10

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    12.3 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32L151ZCT6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32L151ZCT6TR is -40°C to 85°C, but it can be extended to 105°C with some limitations on the clock frequency and supply voltage.
  • The internal oscillator (HSI) on the STM32L151ZCT6TR can be configured using the RCC (Reset and Clock Control) registers. The HSI is enabled by setting the HSION bit in the RCC_CR register, and the frequency can be trimmed using the HSITRIM bits in the RCC_ICSCR register.
  • The maximum current consumption of the STM32L151ZCT6TR depends on the operating mode and frequency. According to the datasheet, the maximum current consumption is around 350 mA at 32 MHz with all peripherals enabled, but this can be reduced to around 20 μA in low-power mode.
  • The DMA controller on the STM32L151ZCT6TR can be used to transfer data between peripherals and memory without CPU intervention. The DMA is configured using the DMA_SxCR (stream x configuration register) and DMA_SxNDTR (stream x number of data register) registers, and the transfer is triggered by setting the DMA_SxEN (stream x enable) bit.
  • The BOOT0 and BOOT1 pins on the STM32L151ZCT6TR are used to select the boot mode of the device. BOOT0 is used to select between the internal flash and the system memory, while BOOT1 is used to select between the internal flash and an external memory device.

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STM32L151ZCT6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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