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STM32L443CCF6TR - STMicroelectronics

Description: Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, LCD, analog, audio, AES

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STM32L443CCF6TR - STMicroelectronics PCB footprint - BGA - BGA - STM32L443CCF6TR
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STM32L443CCF6TR - STMicroelectronics  - 3D model - BGA - STM32L443CCF6TR
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STM32L443CCF6TR Details

  • Manufacturer Part Number:

    STM32L443CCF6TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-49

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    R-PBGA-B49

  • Length:

    3.141 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    39

  • Number of Terminals:

    49

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.585 mm

  • Speed:

    80 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3.127 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32L443CCF6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32L443CCF6TR is -40°C to 85°C (industrial grade) and -40°C to 125°C (extended grade).
  • The internal clock source can be configured using the Clock Security System (CSS) and the Power Management Unit (PMU). The HSE (High-Speed External) clock, LSE (Low-Speed External) clock, HSI (High-Speed Internal) clock, and LSI (Low-Speed Internal) clock can be used as clock sources. The clock configuration is done using the RCC (Reset and Clock Control) registers.
  • The maximum current consumption of the STM32L443CCF6TR depends on the operating mode and frequency. In Run mode, the maximum current consumption is around 350 μA/MHz at 32 MHz with all peripherals enabled. In Low Power Run mode, the maximum current consumption is around 150 μA/MHz at 32 MHz with all peripherals enabled. In Sleep mode, the current consumption is around 10 μA.
  • The DMA controller can be used to transfer data between peripherals and memory without CPU intervention. The DMA controller has 12 channels, and each channel can be configured to transfer data between a peripheral and memory. The DMA controller is configured using the DMA registers, and the transfer is triggered by a peripheral request or a software request.
  • The Boot loader is a firmware that runs in the microcontroller's ROM and allows the user to program the device using a serial interface (UART, USB, etc.). The Boot loader can be used to update the firmware, load a new application, or recover from a faulty firmware. The Boot loader is stored in the ROM and is invoked by a specific sequence of events, such as a power-on reset or a boot pin configuration.

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STM32L443CCF6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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