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STM32L476MGY3TR - STMicroelectronics

Description: Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, up to 1MB Flash, 128 KB SRAM, USB OTG FS, LCD, ext. SMPS

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STM32L476MGY3TR - STMicroelectronics PCB footprint - BGA - BGA - WLCSP - 81-ball, 4.4084 x 3.7594 mm, 0.4
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STM32L476MGY3TR - STMicroelectronics  - 3D model - BGA - WLCSP - 81-ball, 4.4084 x 3.7594 mm, 0.4
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STM32L476MGY3TR Details

  • Manufacturer Part Number:

    STM32L476MGY3TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-81

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    R-PBGA-B81

  • JESD-609 Code:

    e1

  • Length:

    4.4084 mm

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    14

  • Number of I/O Lines:

    65

  • Number of Terminals:

    81

  • Number of Timers:

    17

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    131072

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.585 mm

  • Speed:

    80 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.7594 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32L476MGY3TR Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32L476MGY3TR is 80 MHz, but it can be overclocked to 120 MHz with some limitations.
  • The internal oscillator (HSI) on the STM32L476MGY3TR can be configured using the RCC (Reset and Clock Control) registers. Specifically, you need to set the HSION bit in the RCC_CR register to enable the HSI, and then wait for the HSI to stabilize by checking the HSIRDY bit in the RCC_CR register.
  • The VBAT pin on the STM32L476MGY3TR is used to power the Real-Time Clock (RTC) and the backup registers when the device is in power-down mode or when the main power supply (VDD) is turned off. It is typically connected to a battery or a supercapacitor.
  • The DMA controller on the STM32L476MGY3TR can be used to transfer data between peripherals and memory without involving the CPU. You need to configure the DMA channel, set the source and destination addresses, and enable the DMA transfer. The DMA controller will then take care of the data transfer, freeing up the CPU for other tasks.
  • The main difference between the STM32L476MGY3TR and the STM32L476RGT6 is the package type. The STM32L476MGY3TR comes in a LQFP64 package, while the STM32L476RGT6 comes in a LQFP64R package. The LQFP64R package has a smaller footprint and is more suitable for space-constrained applications.

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STM32L476MGY3TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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