STM32WB55RGV6 - STMicroelectronics

STM32WB55RGV6 Details

• Manufacturer Part Number:

  STM32WB55RGV6

• Brand Name:

  STMicroelectronics

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  VFQFPN-68

• Country Of Origin:

  Philippines

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.30

• Manufacturer:

  STMicroelectronics

• YTEOL:

  9

• JESD-30 Code:

  S-XQCC-N68

• JESD-609 Code:

  e3

• Length:

  8 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  68

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC68,.31SQ,16

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1 mm

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.8 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  QUAD

• Width:

  8 mm

• uPs/uCs/Peripheral ICs Type:

  RFSoC