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STM6322MWY6F - STMicroelectronics

Description: STM6322MWY6F, Processor Supervisor 2.5 V, 3 V, 3.3 V, 5 V Active High, Active Low, Open Drain, Push-Pull, reset 5-Pin

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STM6322MWY6F - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT23-5
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STM6322MWY6F - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SOT23-5
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STM6322MWY6F Details

  • Manufacturer Part Number:

    STM6322MWY6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:Y;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:Y;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    4.39

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

STM6322MWY6F Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout for the STM6322MWY6F in the application note AN5096, which includes guidelines for thermal pad connection, thermal vias, and copper pouring to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the guidelines in the datasheet for thermal management, including using a heat sink, thermal interface material, and ensuring good airflow. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal shutdown or throttling if necessary.
  • The recommended decoupling capacitors for the STM6322MWY6F are 100nF to 1uF ceramic capacitors with a voltage rating of 6.3V or higher, placed as close as possible to the power pins. It is also recommended to use a 10uF to 22uF bulk capacitor for each power rail.
  • The STM6322MWY6F requires a specific power sequencing to ensure proper operation. The recommended power sequencing is to power up the VDDA and VDD pins simultaneously, followed by the VDDIO pin. The power-down sequence should be reversed. It is also recommended to use a power sequencer or a dedicated power management IC to ensure proper power sequencing.
  • The internal voltage regulator of the STM6322MWY6F has a limited current capability and may not be able to supply the maximum current required by the device. It is recommended to use an external voltage regulator or a power management IC to ensure a stable and reliable power supply.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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