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STM6601CQ2BDM6F - STMicroelectronics

Description: Smart push-button on/off controller with Smart Reset™ and power-on lockout

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STM6601CQ2BDM6F - STMicroelectronics - PCB symbol
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STM6601CQ2BDM6F - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN12
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STM6601CQ2BDM6F - STMicroelectronics - 3D model - Small Outline No-lead - TDFN12
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STM6601CQ2BDM6F Details

  • Manufacturer Part Number:

    STM6601CQ2BDM6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    12

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC12,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.008 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

STM6601CQ2BDM6F Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5076, which includes guidelines for thermal pad connection, thermal vias, and copper pouring to ensure optimal thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to reduce the device temperature.
  • The STM6601CQ2BDM6F has built-in ESD protection on all pins, with a human body model (HBM) rating of 2 kV and a charged device model (CDM) rating of 500 V. To prevent latch-up, ensure that the device is powered up and down slowly, and avoid voltage spikes or transients on the power supply lines.
  • Yes, the STM6601CQ2BDM6F is qualified for automotive and high-reliability applications, with a PPAP (Production Part Approval Process) level 3 rating. However, it's essential to follow the recommended operating conditions, and ensure that the device is used within its specified temperature range and power supply voltage.
  • To troubleshoot issues with the STM6601CQ2BDM6F, start by reviewing the device's datasheet and application notes. Check the power supply voltage, clock frequency, and input/output signals for any anomalies. Use oscilloscopes or logic analyzers to capture waveforms and debug the issue. If the problem persists, contact STMicroelectronics' technical support for further assistance.

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STM6601CQ2BDM6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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