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STM704SDS6F - STMicroelectronics

Description: 3 V supervisor with battery switchover.

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STM704SDS6F - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8+
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STM704SDS6F - STMicroelectronics  - 3D model - Small Outline Packages - TSSOP8+
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STM704SDS6F Details

  • Manufacturer Part Number:

    STM704SDS6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Additional Feature:

    RESET THRESHOLD VOLTAGE IS 2.925V

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.925V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

STM704SDS6F Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5096, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • To ensure reliable startup and shutdown, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, ensure that the input voltage ramps up and down slowly (typically 10-20 ms) to prevent damage to the device.
  • Operating the STM704SDS6F outside the recommended temperature range (-40°C to 150°C) may affect its performance, reliability, and lifespan. The device may experience reduced efficiency, increased power consumption, or even permanent damage. It's crucial to ensure the device operates within the specified temperature range to guarantee optimal performance and reliability.
  • To troubleshoot output voltage regulation issues, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is properly soldered and mounted. If the issue persists, consult the datasheet and application notes for guidance on adjusting the output voltage and compensating for load transients.
  • To minimize EMI and EMC issues, follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as necessary. Additionally, ensure that the device is properly decoupled and that the input and output capacitors are selected to minimize noise and ripple.

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STM704SDS6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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