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STMPS2151MTR - STMicroelectronics

Description: STMICROELECTRONICS - STMPS2151MTR - Power Load Distribution Switch, High Side, 2 Outputs, 28V, 60A, 0.0135ohm, TSSOP-14

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STMPS2151MTR - STMicroelectronics - PCB symbol
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STMPS2151MTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - so-8/
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STMPS2151MTR Details

  • Manufacturer Part Number:

    STMPS2151MTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

STMPS2151MTR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as using a heat sink or thermal pad, and ensuring good airflow around the device. Additionally, consider using a thermally conductive interface material (TCIM) to improve heat transfer between the device and the heat sink or thermal pad.
  • The recommended soldering conditions for the STMPS2151MTR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's essential to follow these conditions to prevent damage to the device.
  • To handle ESD protection for the STMPS2151MTR, it's recommended to use ESD-sensitive handling procedures, such as using an anti-static wrist strap or mat, and storing the device in an anti-static bag or container. Additionally, consider using ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design.
  • The recommended input and output capacitors for the STMPS2151MTR are X7R or X5R ceramic capacitors with a voltage rating of 10-50V and a capacitance value of 1-10uF. The capacitor selection should be based on the specific application requirements and the device's operating conditions.

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STMPS2151MTR Overview

Use the download button to access the STMPS2151MTR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STMPS, or try a keyword search, such as Power Management Circuits

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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