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STMPS2262TTR - STMicroelectronics

Description: Enhanced dual-channel power switches

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STMPS2262TTR - STMicroelectronics - PCB symbol
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STMPS2262TTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8
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STMPS2262TTR - STMicroelectronics - 3D model - Small Outline Packages - MSOP8
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STMPS2262TTR Details

  • Manufacturer Part Number:

    STMPS2262TTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    ROHS COMPLIANT, MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.3

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

STMPS2262TTR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5012, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The STMPS2262TTR has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • The STMPS2262TTR is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
  • The STMPS2262TTR has a shutdown pin (SHDN) that can be used to put the device in low-power mode. When SHDN is pulled low, the device enters a low-power state, reducing current consumption to less than 1 μA.
  • The recommended input capacitor value for the STMPS2262TTR is 10 μF to 22 μF, with a voltage rating of at least 6.3 V. A larger capacitor value can be used to improve input ripple rejection and stability.

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STMPS2262TTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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