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STNRGPF01 - STMicroelectronics

Description:  Interleaved boost PFC  Up to 3 interleaved channels  CCM, fixed frequency  Average current control, cycle-by-cycle  Inrush current control  Burst mode support  Overcurrent and thermal protection  Soft start-up

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STNRGPF01 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP38
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STNRGPF01 - STMicroelectronics  - 3D model - Small Outline Packages - TSSOP38
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STNRGPF01 Details

  • Manufacturer Part Number:

    STNRGPF01

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-38

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-02-23

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    HAS LOW LEVEL AND HIGH LEVEL O/P CURRENT AS 7.75 MILLI AMP AND 3 MILLI AMP

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G38

  • Length:

    9.7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    34 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

STNRGPF01 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4967, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor values depend on the input voltage, output voltage, and switching frequency. A general guideline is to use a minimum of 10uF ceramic capacitor with a voltage rating of at least 1.5 times the input voltage. However, it's recommended to consult the application note AN4967 and perform simulations to determine the optimal capacitor values for your specific design.
  • The STNRGPF01 is rated for operation up to 105°C ambient temperature, but it's recommended to derate the device's performance and consider thermal management strategies to ensure reliable operation above 85°C ambient temperature.
  • The STNRGPF01 has built-in OVP and UVLO features, but they can be adjusted or customized using external resistors and capacitors. Consult the datasheet and application note AN4967 for guidance on implementing OVP and UVLO in your design.
  • The output capacitor value and type depend on the output voltage, output current, and ripple requirements. A general guideline is to use a minimum of 22uF ceramic capacitor with a voltage rating of at least 1.5 times the output voltage. However, it's recommended to consult the application note AN4967 and perform simulations to determine the optimal output capacitor value and type for your specific design.

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STNRGPF01 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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